Memory spiked first, CPUs followed, now PCBs could be the next victim of the AI boom

TrendForce reports that DRAM and NAND costs will continue increasing in the second quarter of 2026 as demand from AI data ...
Tech Xplore

Brain-inspired chip could make some AI tasks up to 2,000 times more energy efficient

A new type of computer chip that uses the physics of materials to process information could make some artificial intelligence ...
New Scientist

Unprecedented insight into memory champion's brain reveals his tricks

Nelson Dellis credits techniques like the method of loci for his extraordinary memory. Now, brain scans have revealed the ...

New Rowhammer attacks give complete control of machines running Nvidia GPUs

A separate mitigation is to enable Error Correcting Codes (ECC) on the GPU, something Nvidia allows to be done using a ...
Semiconductor Engineering

Reinventing Embedded Memory: Solving The SRAM Scaling Wall

RAAAM is a deep-tech startup spun out of Bar-Ilan University through the Cadence University Incubator Program. They’ve ...
Semiconductor Engineering

The One Bit Problem That Can Break a System

Whether caused by cosmic radiation, voltage glitches, or adversarial attacks, bit flips threaten data integrity, safety ...
PCMag

Avoid the 'AI RAM Tax': 7 Ways to Squeeze More Life Out of Your Existing Memory

The ongoing RAM shortage means you won't be upgrading your memory any time soon, so here are a few ways to make your existing ...
Design And Reuse

Advancing In-Memory Computing: A Global Effort to Build More Efficient AI Hardware

Emerging non-volatile memory ( NVM) technologies are widely viewed as key enablers of IMC architectures. Among them, Resistive RAM (ReRAM) has attracted significant interest due to its combination of ...
Silicon Semiconductor

CEA-Leti and Fraunhofer IPMS validate wafer exchange for ferroelectric memory materials

CEA-Leti and Fraunhofer IPMS have successfully completed the first exchange of ferroelectric memory wafers within the FAMES Pilot Line, marking a pivotal milestone in establishing a shared European ...
Design And Reuse

CEA-Leti and Fraunhofer IPMS Validate Wafer Exchange for Ferroelectric Memory Materials Within the FAMES Pilot Line

Successful HZO Ferroelectric Wafer Loops Confirm Functionality Across FAMES Sites, And Advance Europe’s Collaborative Platform for Next-Generation Non-Volatile Memory GRENOBLE, France and DRESDEN, ...
Tech Xplore

Memristor demonstrates use in fully analog hardware-based neural network

As AI processing demands reach the limits of current CMOS technology, neuromorphic computing—hardware and software that mimic ...
Nanowerk

Atomic jitters power a new kind of probabilistic AI chip

Thermal noise in magnetic tunnel junctions, usually suppressed, now serves as a tunable source of randomness for Bayesian ...