For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...

Digitally prototyping complex designs, such as large physical structures, biological features, and micro-electromechanical systems (MEMS) requires supercomputers running sophisticated multiphysics ...

A prototyping problem is emerging in today’s efforts to electrify everything. What works as a lab-bench mockup breaks in reality. Harnessing and safely storing energy at grid scale and in cars, trucks ...

The latest version of the multiphysics simulation software introduces the Electric Discharge Module, GPU-accelerated simulations, and updates for greater modeling productivity BURLINGTON, Mass., Nov.

Soon after computers entered the technology landscape, finiteelement analysis (FEA) emerged as a method to solve real-world engineering problems. The work of engineers, applied mathematicians, and ...

Structural analyis codes already do a good job predicting the performance of molded plastic parts. Yet, their results never tell the full story because the mechanical properties of those parts depend ...

COMSOL version 6.0 delivers performance improvements and simplifies simulation of many important applications, such as printed circuit board (PCB) design (pictured). COMSOL Inc. (Burlington, Mass., ...

Every quantum computer is unique – both in the way it’s designed and in how it behaves once implemented. First, designers must choose an approach to implementing qubits. Two of the most popular ...

COMSOL has introduced Version 4.3a of COMSOL Multiphysics®, its flagship software for modeling and simulating physics-based systems. With version 4.3a and in response to user requests, COMSOL ...