Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. Parallel miniaturized piezoelectric alignment engines with fly-height sensors enable faster PIC wafer testing. Image ...
PI’s latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. PI’s F-713 6-axis ...
NORTH READING, Mass.--(BUSINESS WIRE)-- Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, ...
Parallel piezo aligners with fly height sensors enable faster PIC wafer testing. (Nanowerk News) PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing ...
PI's latest 6-axis alignment system is available in one-sided and double-sided configurations, upright for PIC assembly or inverted, for photonics wafer-probing applications. (Nanowerk News) PI ...
SAN FRANCISCO, Jan. 21, 2026 /PRNewswire/ -- PI (Physik Instrumente) announced a new technology platform for electro-optical wafer-level testing designed to validate electrical and optical device ...