Tanja Braun, group manager at Fraunhofer Institute for Reliability and Microintegration (IZM), sat down with Semiconductor Engineering to talk about III-V device packaging, chiplets, fan-out and panel ...
An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
Panel maker Innolux is looking to venture into the IC packaging segment by converting its 3.5G LCD panel fab into an advanced packaging plant dedicated to FOPLP (fan-out panel level package) process, ...
FOPLP (fan-out panel level package) will be a new option that is not meant to support pushes to 7nm, 5nm or even more advanced nodes but rather to provide a packaging solution that can achieve IC ...
Semes, a semiconductor equipment company, said on the 16th that it has developed for mass production, for the first time in Korea, the TEPAS100, a sorter for large semiconductor panel-level package ...
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