Micro probes are generally used to check and test small pitch, high-density electronic devices, such as chips, wafers, or ball-grid arrays. Most conventional probes use long, thin cantilever springs ...

Leuven, Belgium. Imec and Cascade Microtech, a FormFactor company, have announced the successful development of a fully automatic system for pre-bond testing of advanced 3D chips. Pre-bond testing is ...

STAr Technologies Inc, a leading supplier of semiconductor test probe cards, today announced the introduction of its new MEMS type micro-Cantilever probe card - STAr Aries Sigma-M, designed and ...

STAr Technologies, a leading manufacturer of semiconductor test probe cards, unveiled the new 3D/2.5D MEMS micro-cantilever probe card for WAT reliability testing. The Virgo-Prima Series probe card is ...

Semiconductor testing has traditionally functioned as a stable screening step in the manufacturing flow so that failing ...

One of the most basic tools for tinkering with electronics is a multimeter. Today, even a cheap meter has capabilities that would have been either very expensive or unobtainable back in the 1970s.

October 13, 2014. TEGAM Inc., a supplier of micro-ohmmeters, has just introduced five new Kelvin probes. When used with TEGAM's R1L bond meters or the 1740 or 1750 micro-ohmeters, they enable ...

The new product maintains the high performance proven with the current Micro Prober “MR502″/”MR612” model while reducing the test takt time, cutting the foot ...

Micro-impact testing is a new repetitive contact technique, developed by Micro Materials, that is becoming more widespread as companies seek to optimise coating adhesion, toughness and resistance to ...