TSMC is expecting to start production of 3nm wafers at its second Japanese chip fab in 2028. The timeline was confirmed in a ...

Taiwan Semiconductor Manufacturing Company (TSMC), the worlds leading contract chipmaker, has confirmed plans to begin equipment installation and mass production of 3-nanometre wafers at its second ...

By Wen-Yee Lee TAIPEI, April 1 (Reuters) - TSMC, the world's largest contract chipmaker, is expected to launch equipment ...

The Taiwanese chipmaker outlines an advanced manufacturing timeline and capacity for its second Japan facility.

JFE Steel, Mitsubishi Gas Chemical, and Mitsubishi Chemical have signed a memorandum of understanding (MoU) to undertake a demonstration project at the Mizushima Complex in Kurashiki City, Japan, ...

Japan and India are accelerating plans to relocate production of legacy semiconductor and LCD technologies to India, aiming to reduce dependence on China and strengthen economic security. Some ...

Taiwan Semiconductor Manufacturing Company or TSMC (TSM) is planning to begin mass production of advanced 3-nanometre (3nm) chips in Japan by 2028, Reuters reported, citing a Taiwanese government ...