A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...
Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
Hosted on MSN
Uncovering hidden losses in solar cells: New analysis method reveals the nature of defects
A joint research team has successfully identified, for the first time, the specific types of defects responsible for efficiency loss in silicon heterojunction (SHJ) solar cells. Subscribe to our ...
Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...
An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...
Researchers demonstrated the mussel-inspired reinforcement of graphene fibers for the improvement of different material properties. A research group under Professor Sang Ouk Kim applied polydopamine ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results